Gold Plating
镀金
Precision gold electroplating for PCB contacts, RF connectors, semiconductor components, and medical devices requiring superior conductivity and permanent corrosion resistance.
Gold plating is an electrochemical process that deposits a layer of high-purity gold (99.9%+) onto metal substrates, delivering the finest combination of electrical conductivity, chemical inertness, and solderability available in surface engineering. At Active Treatment, we perform both hard gold (alloyed with cobalt or nickel for wear resistance) and soft/pure gold plating for applications requiring maximum conductivity and reliability.
Gold's unparalleled combination of electrical conductivity, chemical inertness, and excellent solderability make it the coating of choice for PCB edge connector contacts, RF connectors, semiconductor wire bonding pads, precision relay contacts, and medical device electrodes. The coating provides permanent protection against oxidation, galvanic corrosion, and tarnishing — ensuring reliable performance throughout the product's lifetime.
Active Treatment processes gold plating on copper, copper alloys, and nickel-plated substrates, serving the semiconductor, telecommunications, medical device, and aerospace industries across Singapore and Southeast Asia.
Key Benefits
- Exceptional electrical conductivity — gold has the lowest contact resistance
- Permanent protection against oxidation and tarnishing
- Excellent solderability and wire bondability for electronics assembly
- Biocompatible — safe for medical and implantable device applications
- Hard gold option provides wear resistance for high-cycle connectors
- Selective plating available to minimise gold usage and reduce cost
Specifications
| Substrate | Copper, brass, nickel-plated parts, PCB contacts |
|---|---|
| Thickness | 0.1–5 µm (typical connector: 1–2 µm) |
| Electrolyte | Neutral gold sulfite bath |
| Gold purity | 99.9%+ (soft gold) / Au+Co or Au+Ni (hard gold) |
| Hardness (hard gold) | HV 160–200 |
| Hardness (soft gold) | HV 90–130 |
Frequently Asked Questions
What is the difference between hard and soft gold plating?
Soft (pure) gold (99.9%+ Au) offers maximum conductivity and solderability, ideal for wire bonding and soldered contacts. Hard gold contains cobalt or nickel alloy for dramatically higher hardness (HV 160–200) and wear resistance for connector contact surfaces that are mated and unmated repeatedly.
What substrate is required before gold plating?
Gold is almost always plated over a nickel barrier layer (typically 2–5 µm). The nickel prevents gold from diffusing into the copper substrate and provides a hard, flat surface for uniform gold deposition. We can apply the nickel strike in-house before gold plating.
How thick should the gold plating be for PCB edge connectors?
IPC-4552 specifies 1.27 µm (50 µin) minimum for edge connector contacts. For high-cycle connectors, 2.5 µm (100 µin) or more is recommended. For soldering-only applications, 0.05–0.3 µm over ENIG is sufficient.
Is gold plating biocompatible for medical devices?
Yes. Pure gold is fully biocompatible and approved for implantable medical devices, dental restorations, and direct contact with biological fluids. Please advise us of your regulatory requirements when ordering.
Can you plate selective areas only?
Yes. Selective gold plating is common for PCB edge connectors and RF contacts. We use precision masking fixtures and tape to restrict gold deposition to specific areas, reducing gold usage and cost significantly.
Request a Quote
Contact Active Treatment Pte Ltd in Singapore for Gold Plating. Call +65 6352 9846 or email activetreatment88@yahoo.com.sg.